![]() Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities. DATACON 2200 EVO Vintage 2012 ( Available November 2019 in Europe) In R&D Facility Like new - Hardly Used Comes with many extra spares The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. You can choose from a selection of models, such as 2200 APM, 2200 EVO PLUS or 2200 EVO+. CAE has 45 die attachers currently available for sale from DATACON / BESI. CAE finds the best deals on used DATACON / BESI die attachers. Warning: Missing argument 4 for avia_woocommerce_gallery_thumbnail_description() in /home/csisemi/public_html/wp-content/themes/enfold/config-woocommerce/config. The Datacon 2200 evo hS die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost of ownership. CAE has broad access to semiconductor related equipment direct from fabs, often unavailable through other sources. ![]() Warning: Missing argument 4 for avia_woocommerce_gallery_thumbnail_description() in /home/csisemi/public_html/wp-content/themes/enfold/config-woocommerce/config.php on line 1251 Warning: Missing argument 3 for avia_woocommerce_gallery_thumbnail_description() in /home/csisemi/public_html/wp-content/themes/enfold/config-woocommerce/config.php on line 1251 ![]()
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